AMD’s manufacturing strategy has enabled the company to cost-effectively meet its customers' high-volume, high-quality requirements on a global basis. With wafer fabrication and assembly facilities in key locations around the world, AMD continues to invest in state-of-the-art technology, including copper interconnect and Silicon-on-Insulator (SOI) technologies. AMD is also involved in key strategic alliances, such as Sematech, that drive advances in silicon processes, wafer manufacturing, and packaging technologies.
AMD's Submicron Development Center (SDC) in Sunnyvale, California supports AMD's advanced process technology development efforts, providing the manufacturing "recipe" that has enabled AMD to manufacture high-volumes of its leading-edge products. Development efforts at the SDC lead to continual refinements to AMD's manufacturing process, helping ensure AMD has the manufacturing ability to meet its future production needs as well as help lead the industry to newer, more advanced manufacturing processes capable of producing increasingly smaller microchips.
In Austin, Texas, AMD is currently transitioning to production of Flash memory products at Fab 25. The conversion of Fab 25 from microprocessor production to Flash memory production helps ensure the facility continues to contribute to AMD’s manufacturing success for the foreseeable future.
AMD 's $1.9 billion, state-of-the-art manufacturing facility, Fab 30 (so named because the facility became operational in 1999, thirty years after the company's founding) in Dresden, Germany, began shipments of the
AMD Athlon™ processor in June 2000. The Dresden facility, using leading-edge 0.13 micron process technology, greatly expands AMD's capacity to produce high-performance microprocessors. Fab 30 was the first European wafer fab to use copper interconnect in its production processes and is leading the production of SOI-based products with AMD’s upcoming generation of AMD Athlon and AMD Opteron™ microprocessors based on Hammer technology.
Three Spansion joint venture fabs in Aizu-Wakamatsu, Japan, manufacture AMD's innovative, low-voltage Flash memory devices. The first Spansion Fab, JV1, produces Flash memory devices on 0.32 and 0.23 micron process technology. Nearby, Spansion Fab JV2 produces Flash memory products on 0.23 micron process technology. And in July 2000, Spansion broke ground for its third Flash memory fab in Aizu-Wakamatsu. Spansion Fab JV3 is now producing AMD's memory devices on 0.17 micron technology. This $1.5 billion facility includes a shell for future expansion.
AMD has also entered into a comprehensive alliance with United Microelectronics Corporation (UMC) for the joint ownership and operation of a 300mm wafer fabrication facility expected to begin production in 2005 in Singapore. UMC will also serve as a foundry partner for AMD processors, with first production expected to be available in 2003.
Test & Assembly
While the exotic and expensive wafer-fabrication facilities are the primary focus of attention in most discussions of microchip manufacturing, the often overlooked "back-end" manufacturing facilities play an equally important role in consistent manufacturing practices. These facilities are high-tech plants in their own right, and every product must pass through one of them before it reaches a customer. AMD's back-end manufacturing facilities are located in Penang, Malaysia; Bangkok, Thailand; Singapore and Suzhou, China. Product assembly, testing and packaging take place at these sites. In addition, AMD has tapped the large pool of talented engineers available in Asia and has established product engineering teams at these plants as well. At these locations, AMD employees work in carefully controlled production environments. Sophisticated quality and process control systems are integrated directly into production lines, giving workers and managers the information they need for continuous improvement of the manufacturing process.
AMD's Penang plants cover more than 415,000 square feet, and assemble, test and develop design packages for advanced logic and memory devices. Singapore is a test facility for AMD's most sophisticated devices, and also serves as a center for measuring, analyzing and resolving customer-satisfaction issues. The facility in Bangkok, Thailand is one of the world's most modern assembly plants. Operations there include plastic assembly and testing, marking and packing of AMD’s logic and memory products. Suzhou, China, which began operations in January 1999, assembles and tests cost-sensitive, high-volume devices such as Flash memory devices.
|
Location
|
Activity
|
Wafer Size
|
Present Prod. Design
Rules
|
Clean Room
|
Clean Room
Sq. Ft.
|
|
Sunnyvale, California
|
|
SDC
|
Research and
Development
|
8 inch
|
0.13 and 0.10 micron
|
Class 1
|
42,500
|
|
Austin, Texas
|
|
Fab 25
|
Flash memory
|
8 inch
|
0.17
|
Class 1
|
123,000
|
|
Dresden, Germany
|
|
Fab 30
|
Processors
|
8 inch
|
0.13 micron
|
Class T100
|
150,000*
|
|
Aizu-Wakamatsu, Japan
|
|
Spansion JV1
|
Flash memory
|
8 inch
|
0.32 and 0.23 micron
|
Class 1
|
65,950
|
|
Spansion JV2
|
Flash memory
|
8 inch
|
0.23 micron
|
Class 1
|
89,700
|
|
Spansion JV3
|
Flash memory
|
8 inch
|
0.17 micron
|
Class 1
|
110,000
|
*After completion of construction in 2003
Test &
Assembly
|
Location
|
Activity
|
Clean Room
|
Total Sq. Ft.
|
|
Bangkok, Thailand*
|
Test and assembly
|
Class 10K
(Assy FOL)
Class 30K (CSP Assy EOL)
Class 100K (Plastic Assy, EOL and TMP)
|
178,411
|
|
Singapore*
|
Processor Test,
failure analysis, device analysis, IC design
|
Class 1000
|
202,500
|
|
Penang, Malaysia*
|
Test, assembly and
design package development
|
Class 10
|
415,332
|
|
Suzhou, China
|
Test and assembly,
distribution
|
Class 10K (Assy FOL)
Class 30K (Assy EOL)
Class 100K (TMP)
|
202,762
|
*Please contact your AMD Sales
representative should you need to visit one of AMD's facilities in Southeast Asia.
Quality
Support
|
Location
|
Activity
|
Clean Room
|
Total Sq. Ft.
|
|
Frimley, England
|
Quality support
|
n/a
|
22,000
|
