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AMD in Dresden
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AMD Saxony and AMD Fab 36 at a glance
Advanced Micro Devices (NYSE: AMD) is a leading global provider of innovative processing solutions in the computing, graphics and consumer electronics markets. AMD is dedicated to driving open innovation, choice and industry growth by delivering superior customer-centric solutions that empower consumers and businesses worldwide.
With development and manufacturing facilities in the U.S., Germany and Asia, AMD is a truly global company.
AMD in Dresden
At present, AMD employs approximately 3,000 highly qualified engineers, technicians and specialists in Fab 30, Fab 36, the Dresden Design Center, AMD’s product development group in Europe and the Operating System Research Center. The OSRC will ensure that AMD’s products are optimally supporting the needs of modern operating systems in future generations of AMD processors.
AMD has concentrated its production capacity for microprocessor wafers in the Saxon capital. AMD’s investment in Saxony has helped to establish the Dresden region as one of Europe’s leading centers of microelectronics.
Fab 30
AMDs Fab 30 is considered to be one of the leading semiconductor manufacturing facilities in the world that produces microprocessors on 200 mm wafers. Since production began in 1999, Fab 30 has regularly implemented leading-edge technologies into high-volume production. Thus, AMD Fab 30 has successfully helped to strengthen AMD’s reputation as a technology leader.
Fab 36
AMD’s second investment in Dresden builds upon the success of Fab 30. Groundbreaking for Fab 36, AMD’s first manufacturing facility for 300 mm wafers, took place in late 2003. In late 2005, Fab 36 started its highly automated production of microprocessors in 90 nm technology. According to plan, production shipments followed in the first quarter of 2006. Currently, Fab 36 manufactures in 65 nm technology.
Fab 38
AMDs newest fabrication facility will come online through a major transformation of the company’s existing 200 mm facility Fab 30, which will be named Fab 38. The ongoing transition from 200 mm to 300 mm wafers allows for more than twice as many processors on a wafer.
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